SMARTIEHS develops a smart, high-speed, cost effective and
flexible inspection system for production of
Micro(Opto)ElectroMechanicalSystems (M(O)EMS). SMARTIEHS decreases the
inspection time of a wafer by a factor of 100. It cuts production costs and
shorten the time to market.
To achieve this, SMARTIEHS develops an innovative measurement concept: a
probing wafer consisting of an array of micro optical sensors is adapted to
and aligned with the wafer under test. The design and production of the
micro-optical interferometer array inspects 100 M(O)EMS structures within
only one measurement cycle. A multifunctional approach of the measurement
concept allows the inspection of passive and active parameters within one
inspection system. A novel smart pixel detector array is developed.
Continued below .......
SMARTIEHS provides a multifunctional design with two interferometer
configurations; a low coherent interferometer and a laser interferometer.
The project focuses on the measurement of shape and deformation, resonance
frequency and vibration amplitude distribution. The SMARTIEHS technology
will be validated and demonstrated with industrial end users. The work in
SMARTIEHS will be organised in eight work packages: Project management,
Inspection system design, Micro-optical interferometer system design,
Micro-optical wafer production, Smart pixel camera development, inspection
system integration, Inspection system test and validation, Exploitation and
The SMARTIEHS consortium has RTD partners and industrial users: SINTEF
(low-coherence interferometry, micro optics), WUT (laser interferometry,
micro optics), Fraunhofer (production of Diffractive Optical Elements), CNRS
(production of refractive optics, micro lenses), CSEM (design and production
of smart pixel detector arrays), Heliotis (exploitation), IMMS (macro design
of the inspection system), and Techfab (end user and validation).
SMARTIEHS lasts 38 months and has a budget of 3,77M Euro. Requested EC
contribution is 2,85 M Euro.