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The objective of ENCAST is to
organize a Network under the umbrella of a Co-ordinated Action to gather and
disseminate information on semiconductor and microelectronic manufacture,
assembly, pacakging and test technologies to the European electronics
manufacturing industry. Typical technologies to be monitored include wafer
scale packaging, 3D packaging, SiP, SOP, MCM, stacked packages, Pb-free
soldering etc. This will be carried out by organizing workshops and meetings
on the above technologies and disseminating the information via a regularly
published newsletter and on a web site freely accessible to the
semiconductor and microelectronics engineering community. Information will
also be gathered and disseminated by the same method by attending other
workshops, conferences, meetings, etc. worldwide.ms within a competitive
amount of time. Continued below .......
In particular standards for the procurement and use of semiconductor
die will be persued by participation in the IEC TC 47 working group
producing the IEC 62258 standard, by organizing an International workshop
CAST 2005, by co-ordinating with other groups such as Netpack, NEXUS-Plus,
SEMI Europe, DPC and the Napa KGD workshop in the USA. Also a Die Products
User Club will be formed to assist SME's in the use of these components and
technologies in Europe
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